中文
400-888-0829
SAM Auto Wafer 304
Application
This line was specially developed for the inspection of wafers or bonded wafers (MEMS) to detect cavities, inclusions, or delamination in bonded layers.
Features
Loadport can be docked with standard Cassette
Aligner wafer calibration, edge detection
Dedicated wafer Robot for sampling, barcode reading, and sample placing in the sink
Four probes collaborate for rapid wafer ultrasound detection
Technical Parameter
Application
4” , 6”, 8”, 12”wafers
Dimension
2400x2000x1300㎜
Transducers
4 transducers, customizable
Resolution
1～4000 μm
Bandwidth
1-500 MHz
Scanning Settings
High precision scanning, fast scanning
Platform
Marble
X/Y axis
Linear motor, gantry double drive
Max Scanning Speed
2000mm/s
Max acceleration
2G/s
Frequency
Compatible with 1~300MHz
Fixture
Dedicated to wafer, customizable
Auto Loading and unloading
Customizable
Samples
Recommended Products
滬公網(wǎng)安備 31011202013830號(hào)